AH3 high dy namic range gain block data sheet: rev d 0 6 / 0 5 /201 2 - 1 of 7 - disclaimer: subject to change without notic ? 2 012 triquint semiconductor, inc. connecting the digital world to the global network ? applications sot - 89 packa ge ? 3g / 4g mobile infrastructure ? cdma, wcdma, lte ? if applications product features functional block diagram ? 50 C 870 mhz ? +41 dbm oip3 ? 3 db noise figure ? 13 db gain ? +20 dbm p1db ? internally matched ? single +5 v supply ? mttf > 100 years ? lead - free/ green/rohs - compliant sot - 89 package general description pin configuration the AH3 is a high dynamic range amplifier in a low - cost surface - mount package. the combination of low noise figure and high output ip3 at the same bias point makes it i deal for receiver and transmitter applications. the device combines dependable performance with superb quality to maintain mttf values exceeding 100 years at mounting temperatures of +85 c. the AH3 is available in the environmentally - friendly lead - free/ green/rohs - compliant sot - 89 package. the broadband amplifier uses a high reliability gaas mesfet technology and is targeted for applications where high linearity is required. in addition, the AH3 is internally matched for 50 ohms. pin # symbol 1 rf input 2 gnd 3 rf output 4 gnd paddle ordering i nfo rmation part no. description AH3 - g high dynamic range amplifier standard t/r size = 1000 pieces on a 7 reel . rf in gnd rf out gnd 1 2 3 4 not recommended for new designs recomme nded replacement part: tqp3m9028 www.datasheet.net/ datasheet pdf - http://www..co.kr/
AH3 high dy namic range gain block data sheet: rev d 0 6 / 0 5 /201 2 - 2 of 7 - disclaimer: subject to change without notic ? 2 012 triquint semiconductor, inc. connecting the digital world to the global network ? specifications absolute maximum ratings parameter rating storage temperature - 55 to +125 o c rf input power, cw, 50 , t = 2 5 oc +10 dbm supply voltage , v dd +6 v thermal resistance (j nc. to case) t jc 59 o c/w operation of this device outside the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max unit s v dd +3 +5 +5.25 v t j (for > 10 6 hours mttf) 160 o c operating temp. range - 40 +85 o c electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical spe cifications test conditions unless otherwise noted: v dd = +5 v, t lead = 25 qc, 800 mhz. parameter conditions min typical max unit s operational frequency range 50 870 mhz test frequency 800 mhz gain 12 12.9 14 db input return loss 10 db ou tput return loss 20 db output p1db +20 dbm output ip3 see note 1 . +37 +41 db m noise figure 2.9 db supply voltage, v dd +5 v supply current, i dd 120 150 180 ma notes : 1. 3oip measured with two tones at an output power of +5 dbm/tone sepa rated by 10 mhz. the suppression on the largest im3 product is used to calculate the 3oip using a 2:1 rule. www.datasheet.net/ datasheet pdf - http://www..co.kr/
AH3 high dy namic range gain block data sheet: rev d 0 6 / 0 5 /201 2 - 3 of 7 - disclaimer: subject to change without notic ? 2 012 triquint semiconductor, inc. connecting the digital world to the global network ? device characterization data s - p arameter data test conditions unless otherwise noted: v dd = +5 v, t lead = 25 c, calibrated to device leads freq ( mhz) s11 (db) s11 (ang ) s21 (db) s21 (ang ) s12 (db) s12 (angle) s22 (db) s22 (ang ) 50 - 11.93 - 33.34 14.15 169.58 - 19.95 7.77 - 18.60 - 126.62 100 - 13.21 - 28.09 13.95 170.57 - 19.98 2.69 - 20.54 - 149.57 150 - 13.51 - 28.85 13.85 169.10 - 19.86 0.25 - 21.16 - 160.72 200 - 13.48 - 32.18 13.83 167.34 - 19.85 - 1.46 - 21.23 - 167.36 250 - 13.55 - 36.10 13.81 164.90 - 19.87 - 3.41 - 20.91 - 170.48 300 - 14.05 - 44.73 13.78 162.57 - 19.86 - 4.62 - 19.26 - 177.22 350 - 14.12 - 48.60 13.75 160.01 - 19.91 - 5.48 - 19.07 - 175.89 400 - 13.53 - 55.70 13.70 157.51 - 19.92 - 7.31 - 19.12 - 178.33 450 - 13.60 - 61.16 13.69 155.04 - 19.95 - 7.85 - 18.71 - 179.04 500 - 13.32 - 65.93 13.65 152.52 - 19.90 - 10.12 - 18.67 178.55 550 - 13.11 - 70.97 13.60 150.15 - 19.85 - 10.20 - 18.46 178.78 600 - 12.65 - 75.7 8 13.52 147.48 - 19.91 - 11.07 - 18.43 177.91 650 - 12.43 - 80.45 13.51 145.06 - 19.89 - 12.83 - 18.29 177.33 700 - 12.10 - 84.62 13.46 142.56 - 19.87 - 12.67 - 18.31 175.94 750 - 11.79 - 88.75 13.39 140.08 - 19.82 - 14.15 - 18.29 176.28 800 - 11.54 - 93.43 13.33 137.61 - 19.92 - 14.94 - 18.18 174.92 850 - 11.28 - 96.17 13.26 135.38 - 19.84 - 15.94 - 18.26 173.97 900 - 10.97 - 100.66 13.21 132.61 - 20.09 - 16.96 - 18.20 174.37 950 - 10.69 - 104.85 13.08 129.83 - 20.09 - 19.21 - 18.35 175.02 1000 - 10.53 - 107.99 13.04 127.70 - 19.92 - 19.33 - 17.83 174.09 0 2 4 6 8 10 12 14 16 0 200 400 600 800 1000 gain (db) frequency (mhz) gain vs. frequency - 25 - 20 - 15 - 10 - 5 0 0 200 400 600 800 1000 s11, s22 (db) frequency (mhz) return loss s11 s22 www.datasheet.net/ datasheet pdf - http://www..co.kr/
AH3 high dy namic range gain block data sheet: rev d 0 6 / 0 5 /201 2 - 4 of 7 - disclaimer: subject to change without notic ? 2 012 triquint semiconductor, inc. connecting the digital world to the global network ? reference design 50 - 870 mhz (AH3wb - pcb) typical performance 50- 800 mhz (AH3wb - pcb) test conditions unless otherwise noted: v dd = +5 v, t lead = 25 c 0 3 6 9 12 15 50 200 350 500 650 800 950 gain (db) frequency (mhz) gain vs. frequency - 30 - 25 - 20 - 15 - 10 - 5 0 0 200 400 600 800 1000 s11, s22 (db) frequency (mhz) millions return loss vs. frequency s11 s22 frequency mhz 50 450 800 gain db 13.2 13 12. 5 input return loss db 8.4 16 15 output return loss db 18.7 16 15 output p1db dbm +20 +20 +20 oip3 @ g%pwrqhi 0+ dbm +36 +40 +41 noise figure db 6 3.5 3.4 i dd ma 150 v dd v +5 bill of material ref des value description manufacturer part number q1 high dynamic range block triquint AH3 c1 1000 pf cap, chip, 0603, 5%, 5 0v, x7r various c2 .01 uf cap, chip, 0603, 5%, 50v, x7r various l1 12 nh ind, chip, 0603, 5% various l2 390 nh coil wire - wound, 1008, 5% coilcraft 1008cs - 391xjlc www.datasheet.net/ datasheet pdf - http://www..co.kr/
AH3 high dy namic range gain block data sheet: rev d 0 6 / 0 5 /201 2 - 5 of 7 - disclaimer: subject to change without notic ? 2 012 triquint semiconductor, inc. connecting the digital world to the global network ? pin description rf in gnd rf out gnd 1 2 3 4 pin symbol description 1 rf in rf input. internally dc grounded. no dc blocking capacitor required. 2 , 4 gnd rf/dc ground. ensure goo d solder attach for optimal rf a nd thermal performance. 3 rf out rf output. dc supply input. applications information pc board layout circu it board material: .062 total thickness with a .014 fr - 4 top rf layer, 4 layers (other layers added for rigidity), 1 oz copper, 50 ? microstrip line details: width = .025. the pad pattern shown has been developed and tested for optimized assembly at tri quint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommended. for further technical information, refe r to http://www.triquint.com/prodserv/more_info/default.aspx?prod_id=AH3 www.datasheet.net/ datasheet pdf - http://www..co.kr/
AH3 high dy namic range gain block data sheet: rev d 0 6 / 0 5 /201 2 - 6 of 7 - disclaimer: subject to change without notic ? 2 012 triquint semiconductor, inc. connecting the digital world to the global network ? mechanical information package information and dimensions mounting configuration notes: 1. ground / thermal vias are critic al for the proper performance of this device. vias should use a .35mm (#80 / .0135) diameter drill and have a final plated thru diameter of .25 mm (.010). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal therma l performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via region co ntacts the heatsink. 4. do not put solder mask on the backside of the pc board in the region where the board cont acts the heatsink. 5. rf trace width depends upon the pc board material and construction. 6. use 1 oz. copper minimum. all dimensions in millimeters (inches) angles are in degrees lead - free/green/rohs - compliant . package pin plating - nipdau. c ompatible with lead - free (tmax=260 c ) and lead (tmax= 245 c ) so ldering processes . the AH3 - g will be marked with an AH3g designator. an alphanumeric lot code (xxxx - x) is also marked below the part designator on the top surface of the package AH3g xxxx - x www.datasheet.net/ datasheet pdf - http://www..co.kr/
AH3 high dy namic range gain block data sheet: rev d 0 6 / 0 5 /201 2 - 7 of 7 - disclaimer: subject to change without notic ? 2 012 triquint semiconductor, inc. connecting the digital world to the global network ? product compliance information esd information esd rating: class 1b value: passes 500 to < 1000 v. test: human body model (hb m) standard: jedec standard jesd22 - a114 esd rating: class i v value: passes 1000 to < 2000 v. test: charged device model (cdm) standard: jedec standard jesd22 - c101 solderability this part is compliant with eu 2002/95/ec rohs directive (restricti ons on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating t he part is rated moisture sensitivity level 1 at 260c per jedec standard j - std - 020. contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information ab out triquint: web: www.triquint.com tel: +1.503.615.9000 email: info - sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sj c applications.engineering@tqs.com important notice the information contained herein is believed to be reliable . triquint makes no warranties regarding the information contain ed herein . triquint assumes no responsibili ty or liability whatsoever for any of the information contained her ein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with al l faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for t riquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual pro perty rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to c ause severe personal injury or death. www.datasheet.net/ datasheet pdf - http://www..co.kr/
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